BGA Repair & Rework

Experience, expertise and results for BGA repair and rework

Our engineers have refined traditional ball grid array (BGA) methodology to make the intricate process of rework repeatable, consistent and reliable. Our decades of experience keep us at the forefront of the latest package styles and techniques. We also offer full pad and trace repair services for boards with BGAs, as well as process troubleshooting of BGAs for initial assembly.

Full range of BGA repair and rework services

Comprehensive reballing services, including pad and trace repair for boards with BGAs, along with process troubleshooting of BGA issues during initial assembly. BGA services include BGA component removal, X-ray or optical verification, circuit design changes and more.

Every step monitored for superior quality control

Our automated tracking systems automatically document every step-by-step detail of the rework process, such as subprocesses required, components replaced and time stamping on unit packaging. All repair activity, including disassembly and reassembly, sequence of repair, and parts and subassemblies replaced is similarly tracked.

Searching for a BGA repair and rework solution? Contact us.

Syrma TechnologyBGA Repair & Rework