We’ve refined traditional ball grid arrays (BGA) repair & rework methodology to make the intricate process of rework repeatable, consistent, and reliable. Our decades of experience keep us at the forefront of the latest package styles and techniques. We offer full pad and trace repair services for boards, as well as process troubleshooting of BGAs for initial assembly.
Comprehensive repair & rework services, including pad and trace repair for boards with BGAs, along with process troubleshooting of issues during initial assembly. Our services include component removal, x-ray or optical verification, circuit design changes, as well as analysis and repair of printed circuit board assembly (PCBA), embedded firmware, and components. We re-test to ensure return to original out-of-the-box functionality.
Our automated tracking systems automatically document every step-by-step detail of the repair & rework process, such as subprocesses required, components replaced, and time stamping on unit packaging. All repair activity, including disassembly and reassembly, sequence of repair, and parts and subassemblies replaced is similarly tracked.